FPC Precision Hardware Terminal is produced by high-speed stamping machine.

     The production process of high-speed stamping machine for FPC precision hardware terminals can be summarised in the following key steps:

    Material Preparation: Selection of suitable flexible substrates, conductive materials and insulating materials, and adjusting the width of the material through the slitting machine.
    Punching and drilling: High-performance mechanical drilling machines are used to punch out the required holes in the material, ensuring that the holes are accurately positioned.
    Copper plating: A uniform metallic layer is formed on the hole walls to achieve electrical conductivity.

  FPC precision hardware terminal high-speed stamping

    Graphics Transfer: Transferring the circuit graphics to the board using dry film and exposure development techniques.
    Etching and Depaneling: Etching away unprotected copper foil to form circuits and cleaning up excess film layers.

  FPC precision hardware terminal high-speed stamping

    Protective film application and press-fit: Protective film is applied to protect the circuitry and the layers are tightly bonded by high temperature and pressure.
    Surface treatment and testing: gold immersion is performed to enhance reliability and electrical testing is performed to ensure quality.

  FPC precision hardware terminal high-speed stamping

     Each step requires strict control of process parameters to ensure the accuracy and performance of the final product.