High-speed press how to stamping chip IC, OREKU precision press to do to show you

    Stamping SMD ICs usually requires the use of a high-speed press, and OREKU precision presses can accomplish this process. The following are the general steps for stamping SMD ICs:
    Designing the Die: Based on the shape and size of the SMD IC, design a suitable stamping die. The mold needs to precisely match the shape of the SMD IC to ensure the accuracy and quality of the stamping.
    Prepare Material: Select a metal material suitable for stamping, such as copper alloy or stainless steel. Ensure that the thickness and properties of the material meet the requirements of the SMD IC.

Gantry 125-ton aeromodule stamping high-speed punching machine

Gantry 125-ton aeromodule stamping high-speed punching machine

    Adjust the press parameters: According to the nature of the material and the requirements of the mold, adjust the parameters of the high-speed press, such as stamping speed, pressure and stroke. The adjustment of these parameters is crucial to the effect and quality of stamping.
    Installation of molds: Install the designed molds on the high-speed press and make sure that the molds are firmly and accurately installed.
    Perform stamping: Place the prepared metal material into the mold and start the high-speed press to perform stamping. During the stamping process, the slide of the press will move up and down at a high speed to stamp the metal material into the shape of the chip IC.
    Quality Inspection: After the stamping process is completed, the IC is inspected for quality, including dimensional accuracy, surface quality and electrical properties. Ensure that the stamped IC meets the relevant standards and requirements.

Gantry 125-ton aeromodule stamping high-speed punching machine