How to ensure the conductivity of terminals when stamping chip terminals at high speed?

     When stamping chip terminals at high speed, the following aspects can be considered to ensure the conductivity of the terminals:

    Material selection
        Select high-purity, metal materials with good electrical conductivity, such as copper and its alloys.
        Ensure that the conductivity of the material meets the conductive requirements of the chip terminal.

    Chip Terminal High Speed Stamping

    Control of temperature during stamping
        Excessively high temperatures may cause phase change or oxidation of the material, affecting the conductivity.
        Optimize stamping speed and pressure to reduce heat buildup generated during the stamping process.

   Chip Terminal High Speed Stamping

    Avoid surface damage
        Scratches, abrasions or indentations to the terminal surface should be minimized during the stamping process.
        Good die design and lubrication can reduce the risk of surface damage.
    Prevent excessive material deformation
        Excessive deformation may disrupt the crystalline structure of the material, thereby affecting electrical conductivity.
        Precise control of stamping process parameters ensures that material deformation is within reasonable limits.

   Chip Terminal High Speed Stamping

    Mold surface quality
        The surface of the mold should be smooth and even to avoid defects on the mold being transferred to the terminal surface.
        Regularly maintain and repair the mold to ensure its surface quality.
    Subsequent treatment
        After stamping is completed, appropriate surface treatment can be carried out, such as removing oxidized layer and cleaning.
        However, care should be taken that the treatment process does not impair the conductivity of the terminals.