High speed stamping machine manufacturer: What are the steps and equipment required to produce lead frames and LED brackets

   As a manufacturer of high-speed stamping mechanisms for lead frames, OREKU is highly trusted. Many chip packaging lead frame manufacturers may not initially know how lead frame power semiconductors are produced? What machines and equipment are needed to produce these lead frames? Because many Chinese businessmen just want to make money, but our OREKU not only provides metal base lead frame stamping machines, but also provides one-stop services for customers to achieve business win-win.C-type high-speed punching machine

  The first step is to start from the stamping part, which is the beginning of all production. The semiconductor lead frame is automatically stamped and produced. The entire semiconductor lead chip DIPs high-speed stamping production line is composed of the following equipment, as shown in the figure: metal coil placement equipment, uncoiler, with single or double stations to choose from, metal sheet straightening machine automatic feeder, high-speed feeder, servo feeder, gear feeder, fixture feeder, roller feeder and other different types. This type of metal sheet part lead frame high-speed punch can choose finished product collection device in C-type high-speed punch and gantry H-type high-speed punch, usually using automatic cutting device and conveyor belt, or if the finished product is coil, the uncoiler can also be used for reverse winding.

  The second production step is the laser marking process: because the raw material of the lead frame of the electronic circuit board, copper strip, is electroplated, the use of a laser marking machine can directly laser print the logo to achieve semiconductor packaging.C-type high-speed punching machine

  The third production step is the injection molding process for encapsulating the lead frame. After completing the bonding and lead bonding of the LSI chip, the next step is to inject packaging. Injection molding process: First, transfer the chip and lead frame after wire bonding to the lower mold for packaging, and then cover the upper mold. In other words, the chip is placed in a cavity formed by the upper and lower molds. At this point, apply pressure to both the upper and lower molds simultaneously to make them in close contact, then inject epoxy resin into them and tightly inject into the chip.
In practical practice, many chips are connected to lead frames and then injection molded together. The above is the stamping and manufacturing process of semiconductor lead frame chips. If you want to get more information about semiconductor lead frame chips, please bookmark our website.C-type high-speed punching machine